Customization: | Available |
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Application: | Automobile, Construction, Fiber & Garment, Footwear & Leather, Packing, Woodworking |
Bonding Function: | Liquid Sealing Leak |
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UV glue, also known as photosensitive glue or UV curable glue, is an adhesive that must be cured by exposure to ultraviolet light. Here is an introduction to UV glue:
-Composition and curing principle: mainly composed of oligomers, monomers, photoinitiators, and additives. Photoinitiators absorb energy under ultraviolet irradiation, generating active free radicals or cations, initiating polymerization and crosslinking reactions of monomers and oligomers, and transforming the gel from liquid to solid state within seconds to tens of seconds.
-Advantages
-Fast curing speed: It can be cured in seconds to tens of seconds, which is conducive to automated production and improves efficiency.
-Environmental Protection: No VOC volatile substances, no pollution to the environment, adhesive components are less restricted by environmental regulations, solvent-free, and low flammability.
-High adhesive strength: It can achieve the breaking of the plastic body without delamination.
-Flexible operation: maintains liquid state under visible light, can be modified or adjusted indefinitely, and controls the degree of solidification.
-Low temperature curing: suitable for heat sensitive materials, saving energy.
-Good compatibility: can be used for temperature, solvent, and moisture sensitive materials, and can be repeatedly applied and cured multiple times.
-Common types and characteristics (some examples): For example, 3961 has fast bonding speed and is suitable for precision electronic component assembly; 5056 is UV silicone with flexibility and weather resistance, used for sealing or bonding flexible components; 3311 is a universal low-cost UV adhesive, etc
Product Name | UV Glue & UV Resin |
Material | Polyurethane Acrylic Resin |
Special Features | Bonding |
Adhesive state | liquid |
Curing Method | UV cure |
Chemical Type | Epoxy resin adhesive |
Application Fields
Electronic industry
The diamond substrate for bonding GaN high electron mobility transistors with GaN epitaxial materials solves the problem of diamond adhesion and provides excellent thermal conductivity.
Fixed electronic components, circuit board cladding, sensor packaging, etc.
Transparent material processing
Adhesive bonding of glass furniture, crystal crafts, and acrylic (PMMA) to maintain high transparency.
Anti oxidation glue for encapsulating silver glass rice beads (requiring intelligent monitoring and control).
Plastic bonding
Suitable for common plastics such as PC, ABS, PVC, PS, etc., the special formula can bond difficult to bond materials such as PP and PE.
Other fields
Medical equipment assembly, car headlight repair, jewelry inlay, and optical lens fixation